Tae-Ho Kim, Tae-Kwang Eom, Soo-Hyun Kim, Dae-Hwan Kang, Hoon Kim, Sangho Yu, and Jin Mook Lim “Plasma-enhanced atomic layer deposition of TaCx films using tris(neopentyl) tantalum dichloride and H2 plasma” Electrochemical and Solid-State Letters, 14 (8) D89-D93 (2011).
Tae-Kwang Eom, Soo-Hyun Kim, Dae-Hwan Kang, and Hoon Kim, "Characteristics of plasma-enhanced atomic layer deposited RuSiN as a diffusion barrier against Cu" Journal of The Electrochemical Society Vol. 158, No. 11 D657-D663, 2011 (2011).
Sang-Hyeok Choi,Taehoon Cheon, Soo-Hyun Kim, Dae-Hwan Kang, Gye-Soon Park, and Sunjung Kim “Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating," Journal of The Electrochemical Society Vol.158, No.6 D351-D356, 2011 (2011)
Quanli Hu, Sung Mok Jung, Hyun Ho Lee, Yong-Sang Kim, Young Jin Choi, Dae-Hwan Kang, Ki-Bum Kim and Tae-Sik Yoon “Resistive switching characteristics of maghemite nanoparticle assembly” J. Phys. D: Appl. Phys. 44 (2011) 085403
Taehoon Cheon Sang-Hyeok Choi, Soo-Hyun Kim and Dae-Hwan Kang “Atomic layer deposition of RuAlO thin films as a diffusion barrier for seedless Cu interconnects” 8 March 2011, Electrochemical and Solid-State Letters Vol.14, No.5, D57-D61 (2011).
Junsoo Bae, Kyuman Hwang, Kwangho Park, Seongbu Jeon, Dae-Hwan Kang, Soonoh Park, Juhyeon Ahn, Seoksik Kim, Gitae Jeong, and Chilhee Chung, “Microstructural Characterization in Reliablity Measurement of Phase Change Random Access Memory” Jpn. J. Appl. Phys. 50(4), , 2011p. 04DD12 (2011).
Address
Dep. of Semiconductor Engineering, POSTECH 77,
Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea
(37673)
TEL: +82-54-279-7085
E-mail: daehwankang@postech.ac.kr
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Address
Dep. of Semiconductor Engineering, POSTECH 77, Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk-Do, Korea (37673)
TEL: +82-54-279-7085
E-mail: daehwankang@postech.ac.kr
Copyright ⓒ 2023. Chalcogenide Semiconductor Lab (CSL) All rights reserved | Designed by greypixel
